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2020 Intern / Sandwich Student (Digital Services)

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Digital Services
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East Asia Region
Arup is the creative force at the heart of many of the world’s most prominent projects in the built environment and across industry. Working in more than 140 countries, the firm’s designers, engineers, architects, planners, consultants and technical specialists work with our clients on innovative projects of the highest quality and impact. Our Asia offices employ approximately 2,500 staff and are engaged in prestigious multi-disciplinary projects covering buildings, infrastructure, advisory services, planning and technical consulting areas. We embrace equality, diversity and inclusion in all aspects including individual differences and open-mindedness.

Who are we looking for?

You should be highly motivated, eager to learn, adaptable to a fast-paced learning environment and studying in one of the following disciplines:

• Digital Services
• Data Science
• Information Systems Engineering, Computer Science, Electronics Engineering

Requirements:

• Excellent written and oral communication skills
• Experience with AutoCAD and Microsoft Visio is an asset
• Interest in big data and data analysis
• Interest in networking, structured cabling, security and surveillance systems is desirable
• Interest in software development, programming and scripting (web or mobile)

Your Arup Journey

You will have the opportunities to tackle problems through research, design and analysis in one of the following mode according to your available duration:

Intern : 8 weeks to less than 6 months
Sandwich Student : 6 months to 1 year

This internship will take place in Arup Hong Kong office subject to Hong Kong visa approval granted to the student, if applicable. Visa approval process takes around 4-6 weeks before internship starts.

To learn more about our Internship Programme, please visit us:
https://www.arup.com/careers/graduates-and-interns/east-asia

Start here, go anywhere!

Act now and apply by providing full resume, academic transcripts and covering letter.

Any outstanding documents may delay your application with us.

From February 2020 onwards, candidates not contacted within 8 weeks may consider their applications unsuccessful.

Personal data collected will be used for recruitment purposes only.

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